NVIDIA has unveiled its first AI chip with wafer fabrication completed entirely in the U.S. – the GB300, built on the Blackwell architecture and manufactured at TSMC’s Fab21 in Arizona using a 4nm process. This marks a significant milestone for domestic AI chip production.

However, the chips still require shipment back to Taiwan for CoWoS advanced packaging, as that capability has not yet been established in the U.S. TSMC is currently building packaging facilities in Arizona, and once CoWoS and SoIC are operational, the full AI chip production chain – from wafer to package to server assembly – could be completed stateside.

NVIDIA had already committed Blackwell production to TSMC Arizona. With GB300 samples now produced, the U.S. has proven it can manufacture advanced AI logic chips at scale. Local assembly is also progressing: Foxconn operates a GB300 server plant in Texas, and Wistron has set up AI hardware assembly lines in Dallas.

TSMC has raised its total U.S. investment to $265 billion, including two advanced packaging plants in Arizona, with four more facilities planned. Once SoIC and CoWoS are online, Blackwell and Rubin chips could be fully made in America – from wafer to finished server.

Industry observers note that the U.S. is on track to build the world’s first fully domestic AI chip ecosystem spanning foundry, packaging, and system integration – a shift that will reshape global semiconductor supply chains.

From ICgoodFind: The GB300 is a made-in-USA wafer, but the package is still Taiwan-bound. Until CoWoS lands in Arizona, the U.S. AI supply chain remains one key step short. That gap is where the next wave of packaging investment will flow.